The IT Tester integrates the following three functions: testing, marking and packaging, in a single machine. The machine processes components in flip chip or SMD technology. The machine can be retooled according to the respective component type. The components are picked up from adhesive film or trays, positioned, measured, sorted, marked with a laser and packed in tapes.

The handling system is designed for the testing of wafers and components using testing equipment provided by the customer. It is highly-accurate and offers minimum cycle times.Individual machine components can be modified according to test requirements and component specifications.The concept of the HPWM 2000 handling system is based on a machine platform which is designed for further applications as a line concept. A welded base frame with granite base plate forms the stable, vibration-reducing and temperature-resistant platform for the dynamic movements.

The handling system is designed to process surface mount devices by loading them into individual pockets in carrier tape. The coordinates and rotation of each individual component on the carrier film are transmitted so that the part is then picked up and accurately positioned in the tape pocket.The inspection system also ensures that the components transferred to the tape are with correct orientation.

The handling system is designed for the marking of components. It processes panels on adhesive film in 6“ frames. The components are located, positioned and marked.The machine is designed to mark components of different shape and material. The transport and handling unit are customised for different applications.